Offer details
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Description
- Provides optimum performance and processing capability at a lower cost
- Offers large storage capacity and flexible configurations to scale as needs grow
- Helps reduce energy costs and ease management with efficient design
- Dual-socket computing power optimized for up to 8 total cores standard or up to 12 cores (configure to order only) at lower power usage per core
- Greater memory and storage capacity than previous generations
- Cost-saving design to help achieve data center like computing power at desk-side infrastructure price point
- Optional hot-swap hard disk drives and performance-optimized RAID support
- Mainframe-inspired reliability and quality for maximum uptime
- Energy-efficient design and IBM Systems Director Active Energy Manager™ to save electricity and cooling costs, and reduce noise
- Comprehensive systems management
- Support legacy PCI slots for smooth transitio
- Offers large storage capacity and flexible configurations to scale as needs grow
- Helps reduce energy costs and ease management with efficient design
- Dual-socket computing power optimized for up to 8 total cores standard or up to 12 cores (configure to order only) at lower power usage per core
- Greater memory and storage capacity than previous generations
- Cost-saving design to help achieve data center like computing power at desk-side infrastructure price point
- Optional hot-swap hard disk drives and performance-optimized RAID support
- Mainframe-inspired reliability and quality for maximum uptime
- Energy-efficient design and IBM Systems Director Active Energy Manager™ to save electricity and cooling costs, and reduce noise
- Comprehensive systems management
- Support legacy PCI slots for smooth transitio
Specifications
Processor | |
---|---|
Processor cache type | Smart Cache |
Processor cache | 12 MB |
Thermal Monitoring Technologies | No |
Thermal Design Power (TDP) | 80 W |
Tcase | 77.6 °C |
Supported instruction sets | SSE4.2 |
Stepping | B1 |
Processor threads | 8 |
Processor series | Intel Xeon 5600 Series |
Processor package size | 42.5 X 45 mm |
Processor operating modes | 64-bit |
Processor lithography | 32 nm |
Processor codename | Westmere EP |
Processor code | SLBV4 |
Physical Address Extension (PAE) | 40 bit |
Number of QPI links | 2 |
Memory types supported by processor | DDR3 800/1066 |
Memory clock speeds supported by processor | 800,1066 MHz |
Memory channels supported by processor | Triple |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Maximum internal memory supported by processor | 288 GB |
Idle States | Yes |
FSB Parity | No |
Execute Disable Bit | Yes |
Embedded options available | Yes |
ECC supported by processor | Yes |
CPU multiplier (bus/core ratio) | 18 |
Bus type | QPI |
Conflict-Free processor | No |
Processor frequency | 2.4 GHz |
Number of processors installed | 1 |
Processor model | E5620 |
Processor boost frequency | 2.66 GHz |
System bus rate | 5.86 GT/s |
Processor socket | Socket B (LGA 1366) |
Processor cores | 4 |
Processor manufacturer | Intel |
Motherboard chipset | Intel® 5500 |
Processor family | Intel® Xeon® 5000 Sequence |
Memory | |
Internal memory | 4 GB |
Memory slots | 16 |
Memory clock speed | 1333 MHz |
Maximum internal memory | 128 GB |
Internal memory type | DDR3-SDRAM |
Storage | |
RAID support | Yes |
Optical drive type | DVD-RW |
Maximum storage capacity | 8 TB |
Hot-swap | Yes |
HDD size | 2.5" |
Graphics | |
Maximum graphics card memory | 16 MB |
Graphics card memory type | GDDR2 |
Graphics card | G200e |
Network | |
Networking features | 10/100/1000 |
Ethernet LAN | Yes |
Ports & interfaces | |
VGA (D-Sub) ports quantity | 1 |
USB 2.0 ports quantity | 6 |
Serial ports quantity | 1 |
Ethernet LAN (RJ-45) ports | 2 |
Design | |
Optical drive type | DVD-RW |
Chassis type | Tower (5U) |
Performance | |
Compatible operating systems | Windows Server 2008 R2, Red Hat Linux, SUSE Linux, VMware ESX Server |
Software | |
Compatible operating systems | Windows Server 2008 R2, Red Hat Linux, SUSE Linux, VMware ESX Server |
Processor special features | |
Intel® InTru™ 3D Technology | No |
Intel® Turbo Boost Technology | 1.0 |
Intel® Quick Sync Video Technology | No |
Intel® My WiFi Technology (Intel® MWT) | No |
Intel® Insider™ | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | No |
Intel® Clear Video HD Technology (Intel® CVT HD) | No |
Intel® Anti-Theft Technology (Intel® AT) | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel Trusted Execution Technology | Yes |
Intel Flex Memory Access | No |
Intel FDI Technology | No |
Intel Fast Memory Access | No |
Intel Enhanced Halt State | Yes |
Intel Dual Display Capable Technology | No |
Intel Demand Based Switching | Yes |
Intel Clear Video Technology | No |
Intel 64 | Yes |
Intel® Wireless Display (Intel® WiDi) | No |
Intel Rapid Storage Technology | No |
Enhanced Intel SpeedStep Technology | Yes |
CPU configuration (max) | 2 |
Processor ARK ID | 47925 |
Power | |
Number of power supply units | 1 |
Power requirements | 230V 50Hz |
Redundant power supply (RPS) support | No |
Power supply | 920 W |
Weight & dimensions | |
Width | 218 mm |
Weight | 27.1 kg |
Height | 440 mm |
Depth | 767 mm |
Other features | |
Mac compatibility | No |
Graphics card memory type | GDDR2 |
Graphics card | G200e |
Dimensions (WxDxH) | 440 x 218 x 767 mm |
Recommended operating temperature range (T-T) | 10 - 30 °C |
Recommended humidity operating range | 10 - 75% |