HPE Intel Xeon-Silver 4215R (3.2GHz/8-core/130W) Processor Kit for ProLiant DL360 Gen10
- Brand: HPE
- Category:
- SKU: P24479-B21
- EAN: 0190017437514 4549821349630
Intel Xeon-Silver 4215R (3.2GHz/8-core/130W) Processor Kit for HPE ProLiant DL360 Gen10
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
DL360 Gen10 4215R Kit |
P24479-B21 | |||
|
DL360 GEN10 4215R KIT |
2M2SUW3 | |||
|
Intel Xeon Silver 4215R - 3.2 GHz - 8-core - for Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10, ProLiant DL360 Gen10 View on InTouch |
5669476 | |||
| Tech Data - Sweden |
Intel Xeon Silver 4215R - 3.2 GHz - med 8 kärnor - för Nimble Storage dHCI Small Solution with HPE ProLiant DL360 Gen10, ProLiant DL360 Gen10 |
5669476 | |||
|
HPE DL360 GEN10 4215R KIT View on Webshop |
P24479-B21 |
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Description
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Specifications
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 11 MB |
| Processor cache type | L3 |
| Processor model | 4215R |
| Processor threads | 16 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Packaging data | |
| Package type | Tray |
| Technical details | |
| Market segment | Server |
| Weight & dimensions | |
| Width | 88.9 mm |
| Weight | 540 g |
| Height | 25.4 mm |
| Depth | 108 mm |