Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
HP DL170E G6 L5630 KIT | 612468-B21 |
Related Products
Description
These Intel Xeon processors, with extended lifecycle support,
utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology
to reduce power consumption, increase switching speed,
and significantly increase transistor density over previous 65nm
technology to 820 million transistors.
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology
to reduce power consumption, increase switching speed,
and significantly increase transistor density over previous 65nm
technology to 820 million transistors.
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
Specifications
| Processor | |
|---|---|
| Processor base frequency | 2.13 GHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Thermal Design Power (TDP) | 40 W |
| Processor cache | 12 MB |
| Processor cache type | L3 |
| Processor model | L5630 |
| Processor threads | 8 |
| System bus rate | 5.86 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.750 - 1.350 V |
| Processor boost frequency | 2.4 GHz |
| Number of QPI links | 2 |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Processor family | Intel® Xeon® 5000 Sequence |
| Processor cores | 4 |
| Processor socket | Socket B (LGA 1366) |
| Memory | |
| Maximum internal memory supported by processor | 288 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800,1066 MHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Memory channels | Triple-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 40 W |
| VID Voltage Range | 0.750 - 1.350 V |
| Features | |
| Thermal Design Power (TDP) | 40 W |
| Processor package size | 42.5 mm |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Operational conditions | |
| Tcase | 63.1 °C |
| Technical details | |
| Market segment | Server |
| Weight & dimensions | |
| Processor package size | 42.5 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |