Offer details
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Description
These Intel Xeon processors, with extended lifecycle support,
utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology
to reduce power consumption, increase switching speed,
and significantly increase transistor density over previous 65nm
technology to 820 million transistors.
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology
to reduce power consumption, increase switching speed,
and significantly increase transistor density over previous 65nm
technology to 820 million transistors.
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers.
Specifications
Processor | |
---|---|
Processor base frequency | 2.66 GHz |
Thermal Design Power (TDP) | 50 W |
Processor cache | 12 MB |
Processor cache type | L2 |
Processor model | L5430 |
Processor operating modes | 64-bit |
VID Voltage Range | 0.850 - 1.3500 V |
FSB Parity | Yes |
Component for | Server/workstation |
Processor lithography | 45 nm |
Processor family | Intel® Xeon® 5000 Sequence |
Processor front side bus | 1333 MHz |
Processor cores | 4 |
Processor socket | LGA 771 (Socket J) |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 50 W |
VID Voltage Range | 0.850 - 1.3500 V |
Features | |
Thermal Design Power (TDP) | 50 W |
Processor package size | 37.5 mm |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Number of Processing Die Transistors | 820 M |
Processing Die size | 214 mm² |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology (VT-x) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Operational conditions | |
Tcase | 57 °C |
Technical details | |
Market segment | Server |
Weight & dimensions | |
Processor package size | 37.5 mm |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |