Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
HP DL580 Gen8 Intel Xeon E7-4860v2 (2.6GHz/12-core/30MB/130W) Processor Kit | 3032798 |
Related Products
Description
We are in a multi-year journey to turn HP around, and we have put in place a plan to restore HP to growth. We know where we need to go, and we're making progress.
We continue to drive product innovation in our core markets, with a focus on cloud, security, and big data.
We see big opportunities ahead, and we are well positioned to take advantage of these opportunities with our remarkable set of assets and strengths. We have the people, the plan, and the foundation in place to help us succeed on the next phase of the journey.
We continue to drive product innovation in our core markets, with a focus on cloud, security, and big data.
We see big opportunities ahead, and we are well positioned to take advantage of these opportunities with our remarkable set of assets and strengths. We have the people, the plan, and the foundation in place to help us succeed on the next phase of the journey.
Specifications
| Processor | |
|---|---|
| Processor base frequency | 2.6 GHz |
| Memory bandwidth supported by processor (max) | 85 GB/s |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 30 MB |
| Processor cache type | L3 |
| Processor model | E7-4860V2 |
| Processor threads | 24 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Number of QPI links | 2 |
| Bus type | QPI |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor family | Intel® Xeon® E7 V2 Family |
| Processor cores | 12 |
| Processor socket | LGA 2011 (Socket R) |
| Memory | |
| Maximum internal memory supported by processor | 1.54 TB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1066,1333,1600 MHz |
| Memory bandwidth supported by processor (max) | 85 GB/s |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Features | |
| Maximum number of PCI Express lanes | 32 |
| Thermal Design Power (TDP) | 130 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Operational conditions | |
| Tcase | 73 °C |
| Packaging data | |
| Package width | 52 mm |
| Package depth | 45 mm |
| Technical details | |
| Market segment | Server |
| Weight & dimensions | |
| Package width | 52 mm |
| Package depth | 45 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d |