HPE Intel Xeon E5430 processor 2.66 GHz 12 MB L2

  • Brand: HPE
  • Category:
  • SKU: 457935-B21
  • EAN: 5711045868856 4948382534422 50 ...2534422 5051749566406more
Intel® Xeon® Processor E5430 (12M Cache, 2.66 GHz, 1333 MHz FSB)

Trade Prices

Distributor Product SKU Stock Updated Price
Xeptor IT Distribution QC E5430-6MB Processor Option Kit DL360G05 457935-B21-Ref Register free see stock

Description

Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.

The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.

The Dual-Core Intel Xeon processor 5100 series is compatible with Intel® 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express* and the option of Intel I/O Acceleration Technology.

Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.

Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.

Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.

Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.

4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.

1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.

Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.

Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.

Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.

Specifications

Processor
Processor base frequency2.66 GHz
Thermal Design Power (TDP)80 W
Processor cache12 MB
Processor cache typeL2
Processor system typeDP
Processor modelE5430
Processor threads4
Processor operating modes64-bit
Compatible chipsetsIntel® 5000P, Intel® 5000V, Intel® 5000X, Intel® 5100, Intel® 5400
VID Voltage Range0.85 - 1.35 V
SteppingE0
L2 cache speed2.66 GHz
FSB ParityYes
CPU multiplier (bus/core ratio)8
Component forServer/workstation
Processor lithography45 nm
Processor familyIntel® Xeon® 5000 Sequence
Processor front side bus1333 MHz
Processor cores4
BoxNo
Processor socketLGA 771 (Socket J)
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)80 W
VID Voltage Range0.85 - 1.35 V
Features
Thermal Design Power (TDP)80 W
Processor package size37.5 mm
Thermal Monitoring TechnologiesYes
Idle StatesYes
Execute Disable BitYes
Number of Processing Die Transistors820 M
Processing Die size214 mm²
Embedded options availableNo
Market segmentServer
Processor special features
Intel Virtualization Technology (VT-x)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Demand Based SwitchingYes
Operational conditions
Tcase67 °C
Technical details
Market segmentServer
Weight & dimensions
Processor package size37.5 mm
Other features
Intel® Virtualization Technology (Intel® VT)VT-x