Offer details
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Description
- Intel's latest-generation microarchitecture represents the next step in unprecedented processor performance and dynamic scalability. Designed from the ground up to take advantage of hafnium-based Intel® 32nm hi-k metal gate silicon technology, Intel® Microarchitecture (Westmere) unleashes parallel processing performance enabled by Intel® QuickPath technology providing an integrated memory controller and high-speed interconnect per independent processing core.
- Dynamic scalability, managed cores, threads, cache, interfaces, and power for energy-efficient performance on demand.
- Design and performance scalability for servers, workstations, notebooks and desktops with support for 4-12 cores and up to 24+ threads with Intel® Hyper-Threading Technology (Intel® HT Technology), and scalable cache sizes, system interconnects, and integrated memory controllers.
- Intel® Turbo Boost Technology delivers additional performance automatically when needed by taking advantage of the processor's power and thermal headroom. This enables increased performance of both multi-threaded and single-threaded workloads.
- Dynamic scalability, managed cores, threads, cache, interfaces, and power for energy-efficient performance on demand.
- Design and performance scalability for servers, workstations, notebooks and desktops with support for 4-12 cores and up to 24+ threads with Intel® Hyper-Threading Technology (Intel® HT Technology), and scalable cache sizes, system interconnects, and integrated memory controllers.
- Intel® Turbo Boost Technology delivers additional performance automatically when needed by taking advantage of the processor's power and thermal headroom. This enables increased performance of both multi-threaded and single-threaded workloads.
Specifications
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Memory bandwidth supported by processor (max) | 32 GB/s |
Thermal Design Power (TDP) | 95 W |
Processor cache | 12 MB |
Processor cache type | L3 |
Processor model | X5660 |
Processor threads | 12 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
VID Voltage Range | 0.75 - 1.35 V |
Processor boost frequency | 3.2 GHz |
CPU multiplier (bus/core ratio) | 21 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® 5000 Sequence |
Processor front side bus | 1333 MHz |
Processor cores | 6 |
Processor socket | Socket B (LGA 1366) |
Memory | |
Maximum internal memory supported by processor | 288 GB |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Memory bandwidth supported by processor (max) | 32 GB/s |
Memory channels | Triple-channel |
ECC | Yes |
Power | |
Thermal Design Power (TDP) | 95 W |
VID Voltage Range | 0.75 - 1.35 V |
Features | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 81.3 °C |
Technical details | |
Market segment | Server |