HP Intel Xeon Gold 6152 processor 2.1 GHz 30.25 MB L3
- Brand: HP
- Category:
- SKU: 1XM57AA
- EAN: 0192545130974 5706998288547
Intel Xeon Gold 6152, 30.25M Cache, 2.1 GHz, 140 W TDP, FCLGA3647
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
Z8G4 XEON 6152 2.1 2666 22C CPU2 | 1XM57AA |
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Description
Options, accessories, services and support for all your HP and Compaq products.
Specifications
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Processor series | Intel Xeon Gold 6000 Series |
| Thermal Design Power (TDP) | 140 W |
| Processor cache | 30.25 MB |
| Processor cache type | L3 |
| Processor model | 6152 |
| Processor threads | 44 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 22 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 140 W |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 140 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| HP segment | Business |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel 64 | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel TSX-NI | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 92 °C |
| Packaging data | |
| Package width | 399 mm |
| Package depth | 203 mm |
| Package height | 156 mm |
| Technical details | |
| Market segment | Server |
| Weight & dimensions | |
| Package width | 399 mm |
| Package depth | 203 mm |
| Package height | 156 mm |
| Other features | |
| Compatibility | Z8G4 |