HP Intel Xeon Gold 6144 processor 3.5 GHz 24.75 MB L3
- Brand: HP
- Category:
- SKU: 3BA12AA
- EAN: 5706998288257 0192545309523
Intel Xeon Gold 6144, 24.75M Cache, 3.5 GHz, 150 W TDP, FCLGA3647
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
Z6G4 XEON 6144 3.5 2666 8C CPU2 | 3BA12AA | |||
|
Z6G4 Xeon 6144 3.5 | 3BA12AA |
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Category: PCs/Workstations -
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Category: PCs/Workstations
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Category: PCs/Workstations -
Category: PCs/Workstations -
Category: PCs/Workstations -
Category: PCs/Workstations -
Category: PCs/Workstations -
Category: PCs/Workstations
Description
Bring digital content creations to life with the reinvented Intel® Xeon® Scalable processors[1], available in four feature configurations—Platinum, Gold, Silver, and Bronze—to address your specific workstation deployment in VR and AR, content creation, CAD, and simulations.
Specifications
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.5 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Processor series | Intel Xeon Gold 6000 Series |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 24.75 MB |
| Processor cache type | L3 |
| Processor model | 6144 |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.2 GHz |
| Stepping | H0 |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| HP segment | Business |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel 64 | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel TSX-NI | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 75 °C |
| Packaging data | |
| Package width | 399 mm |
| Package depth | 203 mm |
| Package height | 156 mm |
| Technical details | |
| Market segment | Server |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Weight & dimensions | |
| Package width | 399 mm |
| Package depth | 203 mm |
| Package height | 156 mm |