Cooler Master CryoFuze heat sink compound Thermal paste 14 W/m·K 2 g

Cooler Master CryoFuze heat sink compound Thermal paste 14 W/m·K 2 g

CryoFuze, 14 W/m.K, 0.7ml

Trade Prices

Distributor Product SKU Stock Updated Price
EET

Cryofuze Heat Sink Compound

MGZ-NDSG-N07M-R2 Register free see stock
Exertis IT

COOL CryoFuze

10368241

Description

Close Cold Contact

Thermal Grease CryoFuze
Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities.

High Performance
Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer.

Exceptional Thermal
K value of 14W/mK handles even the most extreme system builds.

Non Corrosive Formula
The non corrosive and oxidation resistant properties prevent solidification and leaves metal contact surfaces unharmed. CryoFuze has a versatile range of temperature performance, maintaining stability from -50°C up to 250°C.

Easy Application
Viscously balanced formula allow for easy application and clean up.

Specifications

Features
TypeThermal paste
Thermal conductivity14 W/m·K
Operating temperature (T-T)-50 - 250 °C
Product colourGrey
Specific gravity2.6 g/cm³
Weight & dimensions
Volume0.7 ml
Weight2 g
Package width113 mm
Package depth163 mm
Package height33 mm
Package weight35 g
Packaging data
Package width113 mm
Package depth163 mm
Package height33 mm
Package weight35 g
Quantity per pack1 pc(s)
Operational conditions
Operating temperature (T-T)-50 - 250 °C
Colour
Product colourGrey
Technical details
Volume0.7 ml
Thermal conductivity14 W/m·K
Operating temperature (T-T)-50 - 250 °C
Logistics data
Master (outer) case width345 mm
Master (outer) case length360 mm
Master (outer) case height256 mm
Products per master (outer) case40 pc(s)
Quantity per pack1 pc(s)